The company provides a series of services in digital imaging as well as different technical services related to this area.
We offer hands on services which can be adapted to the customer if needed. As a young company, there is much interest to position XRI in the forefront of the digital imaging sector.
In this fied we offer customized equipment design and industrialization support.
Flip-chip and Bump-bonding
One key aspect about X-Ray Imatek's technology is the bump bonding. We have put a lot of effort and resources so that this process is understood, optimized and up to commercial standards.
Therefore, we have the facilities and personnel necessary to carry it out completing the bonding of the asic and semiconductor sensor material.
As part of our portfolio of products and services, we offer these services in flip-chip / bump-bonding to others, especially to those companies and institutions interested in small and medium production series.
We use a FC-150 flip-chip bonding machine installed in a CLASS 100 clean room.
- Precise reflow arm.
- Aligment and bonding of pixel detectors up to 15µm.
- We can provide Sn/Pb bump growth on Silicon/Glass 4" wafers.
- We can also provide Under Bump Metal(UBM) service on any chip/substrate shape.
Consultancy services in a wide range
of topics, such as:
• Chips and sensor materials
• Electronics and mechanical systems
• Image processing in the medical field